Samsung unveiled zHBM, a next-generation 3D memory architecture, at the FMS 2026 conference, claiming it delivers roughly eight times the performance of HBM5 through direct stacking of memory on top of AI processors. The company also revived Z-NAND technology aimed at reducing latency by minimizing data transfer distances between storage and processors. Both technologies form part of Samsung’s strategy to address memory bandwidth and density bottlenecks that constrain AI infrastructure performance.
